With the development of flip chip technology, α-particle induced soft errors are gradually increasing. Under the current packaging technology and conditions, the use of low α solder is a cost-effective measure to reduce the incidence of soft errors. The LA Sn-based solder products developed by our company are prepared with low α raw materials, which can effectively reduce the incidence of soft errors. The current low Alpha alloy grades are divided into three, which are usually applied to tin ball products within 100um. We have the XIA UltraLo-1800 ultra low background alpha counter, which is capable of rapid detection of alpha particle radiation levels.

Alpha particle emitting level:

Low Alpha（LA） (<0.01cph/cm2)

Ultra Low  Alpha (ULA) (<0.002 cph/cm2)

Super Ultra Low Alpha (SULA)(<0.001 cph/cm2)